KOVTUN, I. I.; BOIKO, J. M.; PETRASHCHUK, S. A. Reliability Improvement of Printed Circuit Boards by Designing Methods for Solder Joint Technical Diagnostics with Application of Acoustic Emission Method. Visnyk NTUU KPI Seriia - Radiotekhnika Radioaparatobuduvannia, [S. l.], n. 79, p. 60-70, 2019. DOI: 10.20535/RADAP.2019.79.60-70. Disponível em: http://radap.kpi.ua/radiotechnique/article/view/1582. Acesso em: 27 nov. 2021.