2019. Reliability Improvement of Printed Circuit Boards by Designing Methods for Solder Joint Technical Diagnostics with Application of Acoustic Emission Method. Visnyk NTUU KPI Seriia - Radiotekhnika Radioaparatobuduvannia. 79 (Dec. 2019), 60–70. DOI:https://doi.org/10.20535/RADAP.2019.79.60-70.