ПРИЩЕПА, М. Investigation the electrical properties of copper films for integrated circuits. Visnyk NTUU KPI Seriia - Radiotekhnika Radioaparatobuduvannia, [S. l.], n. 43, p. 51-59, 2010. DOI: 10.20535/RADAP.2010.43.51-59. Disponível em: https://radap.kpi.ua/radiotechnique/article/view/191. Acesso em: 21 nov. 2024.