“Reliability Improvement of Printed Circuit Boards by Designing Methods for Solder Joint Technical Diagnostics With Application of Acoustic Emission Method”. 2019. Visnyk NTUU KPI Seriia - Radiotekhnika Radioaparatobuduvannia, no. 79 (December): 60-70. https://doi.org/10.20535/RADAP.2019.79.60-70.