Kovtun, I. I., J. M. Boiko, and S. A. Petrashchuk. “Reliability Improvement of Printed Circuit Boards by Designing Methods for Solder Joint Technical Diagnostics With Application of Acoustic Emission Method”. Visnyk NTUU KPI Seriia - Radiotekhnika Radioaparatobuduvannia, no. 79, Dec. 2019, pp. 60-70, doi:10.20535/RADAP.2019.79.60-70.