Kovtun II, Boiko JM, Petrashchuk SA. Reliability Improvement of Printed Circuit Boards by Designing Methods for Solder Joint Technical Diagnostics with Application of Acoustic Emission Method. RADAP [Internet]. 2019Dec.7 [cited 2024Apr.27];(79):60-7. Available from: https://radap.kpi.ua/radiotechnique/article/view/1582