Reliability Improvement of Printed Circuit Boards by Designing Methods for Solder Joint Technical Diagnostics with Application of Acoustic Emission Method. Visnyk NTUU KPI Seriia - Radiotekhnika Radioaparatobuduvannia, [S. l.], n. 79, p. 60–70, 2019. DOI: 10.20535/RADAP.2019.79.60-70. Disponível em: https://radap.kpi.ua/radiotechnique/article/view/1582. Acesso em: 3 apr. 2025.