Rationale for Choosing Type of Heatsink Profile for New Design of Electronic Module Cooling System
DOI:
https://doi.org/10.20535/RADAP.2023.93.58-69Keywords:
heat exchange, cooling system, thermal performance, convective heat exchanger, heatsink profileAbstract
The reliable operation of complex electronic systems with increased heat generation is ensured by the use of efficient cooling systems, the cost of which is sometimes up to 45% of the cost of electronic modules that are cooled. In this regard, the development of new design solutions aimed at reducing the cost of electronic module cooling systems is an urgent task. In this work, a new design solution to reduce the cost of the basic version of the air cooling system of the transmit/receive (T/R) module is proposed. Instead of the heatsink case of the T/R module made by the method of milling from a solid aluminum plate 53 mm thick, a design is proposed, which consists of two parts: an improved case part, made by the method of milling from an aluminium plate with half the thickness, and a convective heat exchanger attached to it, made from a serial heatsink profile. Active electronic components are in contact with the surface of the heat exchanger through the windows in the case. The main part of this work is devoted to rationale for choosing the most advantageous from a thermal point of view heat sink profile from the existing serial profiles for use in the new cooling system. Using computer simulation, the thermal performance of the proposed cooling system was determined and compared in two versions: based on a serial heatsink profile of type 1 and based on a serial heatsink profile of type 2. Types 1 and 2 of the heatsink profile are similar, but have different geometric characteristics, different number of fins, different fin heights, different base thicknesses and different weights. The purpose of the simulation is to determine the most effective of them for use in the new T/R module cooling system. As a result of simulation, it is shown that the most effective for use in the design of the T/R module air cooling system is a serial type 1 heatsink profile, made of aluminum-magnesium alloy AD 31Т. It has a base thickness of 4 mm, a fin height of 21 mm, a fin pitch of 7 mm, a fin thickness at the base of 2.5 mm, and a fin thickness at the top of 1 mm. The maximum temperature at the installation sites of the hottest transistors on a heat exchanger from a type 1 heatsink profile is 8.7–4.9 °С (or 10.0–8.2%) less than on a type 2 heatsink profile heat exchanger (at air velocity from 1 m/s to 5 m/s). The total thermal resistance of the cooling system using a type 1 heatsink profile is 13.5–11.9% less than using a type 2 heatsink profile. Moreover, the mass of the convective heat exchanger based on the type 1 heatsink profile is 367 g (or 8.5%) less.
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