Determination of reliability parameters of radioelectronic devices determined by thermal modes
DOI:
https://doi.org/10.20535/RADAP.2014.57.92-103Keywords:
reliability, RED, failure, microassembly, thermal field, heat, failure rate, reliability particular, automation, reliability calculationAbstract
Statement of the problem. The reliability is important (and sometimes crucial) functional characteristic for RED. So it is necessary to analyze the impact on them of destabilizing external factors - mechanical, temperature, humidity, ionizing radiation.Structural-design elements RED. SCM are the main objects for which you first need to determine the temperature of the ЕЕS and performance reliability.
Determination of the temperature of the EES cells and microassemblies. The basic mathematical models are presented to determine the temperatures of the electronic structure elements of cells and microassemblies.
Indicators of HEE reliability as a function of their temperature. The value of the operational failure rate of most groups RED calculated by mathematical models. These indicators include: basic failure rate, the rate regime, the coefficients that take into account changes in operational failure rate depending on various factors.
Software definition of reliability parameters. The software product allows you to switch from "manual" calculation reliability REDs to a fully automated modeling components. The program is applicable for calculating the reliability and to find a more "sustainable" elements to increase the probability of failure-free operation.
Conclusions. Primary tasks performed in the work are listed
References
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