Investigation the electrical properties of copper films for integrated circuits
Keywords:copper film, thermionic deposition, microstructure parameters
A comprehensive investigation of the microstructure, electrical and mechanical parameters of copper films obtained thermionic application (TIA) on the glass-ceramic substrate and polycore. The studied parameters were compared with the corresponding parameters of granules fused in a vacuum of copper, of which had been made the studied samples. Studies have shown that the main parameters of copper technology with TIA, close to the values of bulk samples fused in a vacuum of copper.
How to Cite
Authors who publish with this journal agree to the following terms:
- Authors retain copyright and grant the journal right of first publication with the work simultaneously licensed under a Creative Commons Attribution License that allows others to share the work with an acknowledgement of the work's authorship and initial publication in this journal.
- Authors are able to enter into separate, additional contractual arrangements for the non-exclusive distribution of the journal's published version of the work (e.g., post it to an institutional repository or publish it in a book), with an acknowledgement of its initial publication in this journal.
- Authors are permitted and encouraged to post their work online (e.g., in institutional repositories or on their website) prior to and during the submission process, as it can lead to productive exchanges, as well as earlier and greater citation of published work (See The Effect of Open Access).