Investigation the electrical properties of copper films for integrated circuits

Authors

  • M. M. Prischepa National Technical University of Ukraine, Kyiv Politechnic Institute, Kiev

DOI:

https://doi.org/10.20535/RADAP.2010.43.51-59

Keywords:

copper film, thermionic deposition, microstructure parameters

Abstract

A comprehensive investigation of the microstructure, electrical and mechanical parameters of copper films obtained thermionic application (TIA) on the glass-ceramic substrate and polycore. The studied parameters were compared with the corresponding parameters of granules fused in a vacuum of copper, of which had been made the studied samples. Studies have shown that the main parameters of copper technology with TIA, close to the values of bulk samples fused in a vacuum of copper.

Author Biography

M. M. Prischepa, National Technical University of Ukraine, Kyiv Politechnic Institute, Kiev

Прищепа М.М., к.т.н. доцент кафедри радіоконструювання та виробництва радіоапаратури

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Published

2010-11-27

How to Cite

Прищепа, М. (2010) “Investigation the electrical properties of copper films for integrated circuits”, Visnyk NTUU KPI Seriia - Radiotekhnika Radioaparatobuduvannia, 0(43), pp. 51-59. doi: 10.20535/RADAP.2010.43.51-59.

Issue

No. 43 (2010)

Section

Functional Electronics. Micro- and Nanoelectronic Technology

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